Outages at major web hosts can have huge impacts across society, as we see often such as with the recent Cloudflare outage. But a new collaboration between Amazon and Google might just be the start of ...

As many big businesses will confirm, having multiple cloud systems on board can often be a major headache, particularly when it comes to interoperability. AWS is looking to solve these issues with a ...

Smiths Group SMIN0.75%increase; green up pointing triangle said it agreed to sell electric components manufacturer Smiths Interconnect to Koch’s Molex Electronic Technologies in a deal that gives the ...

“Smiths Interconnect has a highly complementary portfolio of advantaged solutions that strongly enhances the platform established by our acquisition of AirBorn last November,” said Joe Nelligan, CEO ...

Oct 16 (Reuters) - Smiths Group (SMIN.L), opens new tab said on Thursday it will sell its interconnect unit to U.S. electronic components maker Molex Electronic in a deal valued at 1.3 billion pounds ...

Foxconn Interconnect Technology (FIT) unveiled its latest high-speed interconnect and thermal management solutions aimed at enhancing 224G generation transmission and energy efficiency at the 2025 ...

AMD's chiplet architecture has not really changed in a fundamental way since the introduction of the Ryzen 3000 processors based on the Zen 2 architecture back in 2019. The move to Socket AM5 ...

TAIPEI, Sept 17 (Reuters) - Foxconn Interconnect Technology's (6088.HK), opens new tab Saudi Arabian joint venture will start building its first manufacturing base in the Middle East in December, ...

The demand for high bandwidth memory (HBM) is accelerating across the semiconductor industry, driven by boundary-pushing artificial intelligence, high-performance computing, and advanced graphics.

With cloud computing, HPC, and now AI driving enterprise computing and the technical challenges and cost connected to semiconductor design and manufacturing increasing, demand for chiplet ...