As semiconductor technology scales down in size, process integration complexity and defects are increasing in 3D NAND flash, partially due to larger stack deposits and thickness variability between ...

Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...

Fabrication of 3D NAND devices involves a challenging and complex deposition and etch process. Two etch processes have been identified as substantially impacting 3D NAND product yields: silicon ...

For several decades, NAND flash has been the primary technology for low-cost and large-density data storage applications. This non-volatile memory is present in all major electronic end-use markets, ...

The part 1 of this two-article series outlined the NAND flash technology and how it transitioned from 2D to 3D NAND flash. The article also explained the current challenges in the way of density ...