Imec presents the first comprehensive thermal study of 3D HBM-on-GPU integration using a system-technology co-optimization ...
The production of high-quality three-dimensional assets has long been constrained by the technical expertise and time investment required to create professional-grade models. Hyper3D, the flagship ...
The objective of the 3D-SCALO problem is to assign the given components to optimal mounting surfaces and position them at the best locations, while satisfying the requirements for (1) heat dissipation ...
MicroCloud Hologram Inc. (NASDAQ: HOLO), ("HOLO" or the "Company"), a technology service provider, innovatively launches a quantum-enhanced deep convolutional neural network image 3D reconstruction ...
Yield and cost have always been critical factors for both manufacturers and designers of semiconductor products. It is a continuous challenge to meet targets of both yield and cost, due to new device ...
As three-dimensional integrated circuit technology becomes the architectural backbone of AI, high-performance computing (HPC) ...
The Covid-19 pandemic has triggered a wave of severe economic disruption around the world, causing widespread chaos, profound changes in the business landscape and overwhelming operational challenges.
UIUC Project AME team members (from left to right) Sharon Tsubaki-Liu, Naomi Audet, Kevin Kim, and Andrew Peterman stand next to their winning design (not pictured, Luke Meyer). A large, strong boom ...
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