A recent study has realized multipartite entanglement on an optical chip for the first time, constituting a significant ...

The advent of big data era raising significant challenges in information processing, especially in the aspect of capacity and power consumption. Situations become even worse when we consider the fact ...

The group is also building an OSAT facility. This is in view of a larger plan to create a hub for chiplet integration and ...

Copper interconnects cannot deliver the high-performance requirements of modern systems, especially with the rapid expansion ...

TL;DR: TSMC is advancing silicon photonics with co-packaged optics (CPO) samples for NVIDIA and Broadcom by 2025, achieving 1.6 terabits-per-second speeds. The technology integrates microring ...

At SEMICON Taiwan 2025, AMD Fellow Daniel Ng, who heads the company's OSAT technology development, laid out a stark assessment of the semiconductor industry's next bottleneck: the energy cost of ...

How a single silicon chip was designed to be microwave and optical signal-processing engine. The various roles for which this engine can be reconfigured. The performance considerations that were ...

Fabrinet’s FN position as a leading optical packaging specialist has become increasingly strategic as the industry transitions to higher bandwidth requirements and advanced data center architectures.

A focus-stacked macro photograph of a fabricated gallium phosphide photonic chip featuring multiple spiral waveguides and other test structures. The chip width is just 0.55 cm across. Due to the high ...