Yahoo Finance

ACM Research Launches Its First Plating Tool to Support Wafer-Level Packaging and Plating Applications in Compound Semiconductor Manufacturing

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Triata Capital Exits ACM Research Position, According to Recent SEC Filing

ACM Research is moving beyond wafer-cleaning tools toward a broader role inside chip fabs, putting ACM Shanghai’s economics ...
Yahoo Finance

ACM Research Significantly Improves Copper Plating Rate and Uniformity for Advanced Packaging Applications with New High-Speed Plating Technology

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Business Wire

Tanaka Precious Metals: Electroplating Engineers of Japan Launched Semiconductor Wafer Cup-type Ultra-compact Plating Laboratory Equipment on July 15, Enabling Plating ...

TOKYO--(BUSINESS WIRE)--Tanaka Holdings Co., Ltd. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Akira Tanae) today announced that Electroplating Engineers of Japan, Limited (Head ...
New Electronics

ACM Research strengthens FOPLP portfolio with launch of Ultra ECP ap-p Tool

ACM Research, a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, has launched the new Panel Electrochemical Plating (Ultra ECP ap-p) tool. This ...
Business Wire

The New Stratus 200 and Stratus 300 Provides Highest Throughput Electrodeposition System with Maximum Wafer Yield

BILLERICA, Mass.--(BUSINESS WIRE)--July 10, 2006--NEXX Systems, a leading provider of processing equipment for advanced wafer level packaging applications, is pleased to introduce the Stratus 200 and ...

SPS-International Announces Wafercassettes.com, a Catalog for Semiconductor Wafer Carriers and Shipping Solutions

A dedicated catalog of PEEK, PFA, polypropylene, and metal wafer cassettes plus shipping containers for fabs, research ...
Nasdaq

ClassOne Technology Delivers First Solstice® S4 Single-Wafer Processing System to Analog Devices

KALISPELL, Mont., June 27, 2024 (GLOBE NEWSWIRE) -- ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today ...
Business Insider

ClassOne Technology Expands Solstice® Single-Wafer Portfolio with New 300mm Solstice Max Platform for Advanced Packaging Metallization

PHOENIX, Oct. 07, 2025 (GLOBE NEWSWIRE) -- SEMICON WEST -- ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today ...
pv magazine International

Copper-plated heterojunction solar cell with 22.1% efficiency, 0.99 bifaciality factor

An international research group has achieved a 22.1% power conversion efficiency in a bifacial heterojunction crystalline solar cell fabricated through copper (Cu) plating metallization. “We developed ...
Nasdaq

ACM Research Launches Its First Plating Tool to Support Wafer-Level Packaging and Plating Applications in Compound Semiconductor Manufacturing

FREMONT, Calif., Aug. 25, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...