SAN JOSE — A consortium of chip-equipment makers here today announced a major deal with Ace Semiconductor to help set up the world's first wafer-level packaging production line in China. Under the ...
This study investigates creation of 1.0µm RDL structures by a damascene process utilizing a photosensitive permanent dielectric material. The advantage of the photosensitive dielectric approach is ...
SAN FRANCISCO — The Semiconductor Equipment Consortium for Advanced Packaging (SECAP) here today announced that it will install a 300-mm wafer-level packaging line at Unitive Inc.'s subsidiary in ...
From powering watches to phones, handheld consoles to desktop PCs, office servers to data centers, processors can be found everywhere and in every size possible. That last aspect is set to take a ...
Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...
TSMC introduced "Wafer Manufacturing 2.0" in July 2024, integrating packaging, testing, and photomask production into its portfolio. This move underscores a seismic shift in the advanced packaging ...
Incorporating the NanoResolution MRS sensor, the WX3000 Metrology and Inspection systems enable the ultimate combination of high speed, high resolution and high accuracy for wafer-level and advanced ...
The market currently experiences rapid technological bifurcation where mechanical methods handle standard output while ...
Strategic partnerships and global collaboration are required to bring advanced packaging from research to real-world impact.
TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...
ASE Technology is committing $200 million to test a new method of chip packaging that replaces traditional round wafers with square substrates, which promises to increase the company's advanced ...
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