ORLANDO, Fla.--(BUSINESS WIRE)--Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and ...

TORONTO, Aug. 12, 2025 /CNW/ - Xanadu, the leading photonic quantum computing company, and DISCO Corporation, renowned precision machine and processing tool manufacturer, are developing advanced wafer ...

LONDON--(BUSINESS WIRE)--Technavio’s latest market research report on the global wafer dicing saws market provides an analysis of the most important trends expected to impact the market outlook from ...

(MENAFN- EIN Presswire) Rest of Asia-Pacific segment contributed the major share in the thin wafer processing and dicing equipment market in 2021. The thin wafer processing and dicing equipment market ...

Date Announced: 11 Apr 2007 J P Sercel Associates announces 100 mm sapphire wafer dicing capability developed with the IX-200 Chromadice™ diode-pumped solid-state (DPSS) UV laser wafer singulation ...

ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has ...

(MENAFN- GlobeNewsWire - Nasdaq) The market currently experiences rapid technological bifurcation where mechanical methods handle standard output while advanced laser solutions address the burgeoning ...

The shift toward more complex IC packages requires more advanced inspection systems in the production flow to capture unwanted defects in products. This includes traditional optical inspection tools ...

The AVIA 355-23-250 UV laser is said to offer the highest pulse repetition rate of any Q-switched UV laser, allowing it to perform high-speed wafer-die singulation with high yields. The 355-nm laser ...

Semiconductor devices are now universal and have a critical role in modern-day society. Semiconductors influence how we provide entertainment, interact and communicate with the world, and enable many ...