High-frequency center-probe test sockets are available for ball grid array, chip-scale, and micro land frame packages with a lead pitch of 0.30 mm. Features include a four-point crown or sharp-point ...
The Lock-Wedge line of IC test clips monitors all of the signals at once on quad-flatpack (QFP), thin-small-outline (TSOP), small-outline (SOIC), and other fine-pitch IC packages. The series covers ...
atg Luther & Maelzer, an Xcerra company, has announced the release and the first installations of the new A7-20 PCB flying-probe test system. Specifically designed for the demands of large format, ...
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