March 9, 2014. Rudolph Technologies Inc. announced the sale of its first NSX 320 TSV Metrology System to CEA-Leti, a leading research organization based in Grenoble, France, which, in the frame of the ...

Nova Measuring Instruments Ltd. (NASDAQ: NVMI), a leading provider of optical metrology solutions to the semiconductor process control market, reported today that two major customers ordered its ...

FLANDERS, N.J.--(BUSINESS WIRE)--Rudolph Technologies, Inc. (NYSE:RTEC) announced today the sale of its first NSX ® 320 TSV Metrology System to CEA-Leti, a leading research organization based in ...

The market for metrology/inspection equipment for 3D through silicon via (TSV) semiconductor packaging looms large, according to The Information Network. The desire for smaller, lighter and more power ...

MILPITAS, Calif.--(BUSINESS WIRE)--Nanometrics Incorporated (NASDAQ:NANO), a leading provider of advanced process control metrology systems, today announced that a major Korean memory manufacturer has ...

ST. FLORIAN, Austria, June 21, 2011 /PRNewswire/ — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced ...

Let us help you with your inquiries, brochures and pricing requirements Request A Quote Download PDF Copy Download Brochure The FilmTek™ 2000M TSV is a fully ...

Nova Measuring Instruments NVMI reported today that two major customers ordered its recently launched TSV (Through-Silicon Via) metrology system, the Nova V2600[TM]. These orders follow a thorough ...

Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 - 1F ...

EVG's new integrated in-line metrology module can detect a variety of process irregularities and defects during temporary bonding and debonding, including: total thickness variation (TTV) of the ...