System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...

Magnum Venus Products, a global manufacturer of fluid movement and production solutions for industrial applications, is launching a new process for closed molding to increase part production by ...

CARY, N.C.—Lord Corp. has been bonding rubber to metal and other substrates for more than six decades. But bonding liquid silicone rubber and thermoplastics to other substrates wasn't quite so simple.

Injection-molded liquid silicone rubber (LSR) is used in the manufacture of many goods, from medical devices to cookware to electronics. Many LSR applications require that the silicone be bonded to ...

Designers under the gun to eliminate assembly and secondary operations are taking a hard look at multicomponent injection molding — a process best known for putting nonslip grips on handheld consumer ...

New Monolithic Lens Molding (MLM) capability enables up to eight-megapixel-and-higher-resolution devices. CHIBA, Japan, Dec. 1, 2010 /PRNewswire/ -- SEMICON JAPAN -- EV Group (EVG), a leading supplier ...

A rapid prototyping process was presented to fabricate a nylon honeycomb microstructure coated with parylene C. The surface structure was designed to obtain a hydrophobic surface using the volume of ...