Datagram has unveiled its Core Substrate, a fully operational, connectivity baselayer built specifically to power real-world applications and DePIN (Decentralized Physical Infrastructure Network) ...
Dublin, May 15, 2025 (GLOBE NEWSWIRE) -- The "Global Advanced IC Substrate Market 2025-2035" report has been added to ResearchAndMarkets.com's offering. The global advanced IC substrate market is ...
TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...
SHENZHEN, China, Dec. 8, 2025 /PRNewswire/ -- PCBAIR announced the launch of its advanced 8-layer Glass Core PCB manufacturing capabilities, combining proprietary Through Glass Via (TGV) technology ...
A recently granted patent (Publication Number: US11751327B2) describes an electrically conductive film for a cell contacting unit in a battery. The film consists of an electrically nonconductive ...
Designed for AI accelerators, high-speed data center servers, and optical transceivers, PCBAIR's 8-layer Glass Core PCBs support finer line widths and spacing, with pilot production and customer ...
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