The Department of Commerce is investing up to $300 million to accelerate the development of technologies to boost the semiconductor industry. The department said Thursday the three entities receiving ...

TOKYO--(BUSINESS WIRE)--Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a ...

As the Artificial Intelligence (AI) and High-Performance Computing (HPC) markets continue to rapidly grow, the semiconductor industry is racing to satisfy customer needs with advanced packaging ...

The Japanese government's efforts to attract foreign semiconductor investment have been very effective, with almost every major international semiconductor manufacturer responding to the call. In ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

The Department of Commerce plans to launch a competition under the CHIPS for America program to fund research and development activities related to advanced semiconductor packaging and has issued a ...

In today’s rapidly advancing technological era, AI has become a powerful catalyst for innovation and progress. Advanced semiconductor packaging plays a crucial role in supporting AI development, while ...

According to projections from Towards Packaging, the global semiconductor and IC packaging materials market is set to increase from USD 53.48 billion in 2026 to nearly USD 114.28 billion by 2034, ...

Needham analyst Charles Shi reiterated Taiwan Semiconductor Manufacturing Co (NYSE:TSM) with a Buy and a $225 price target. Taiwan Semiconductor guided 2025 revenue growth to be in the mid-20s percent ...

Fundamental to all digital technologies, semiconductor chips are a major focal point in twenty-first-century geoeconomic competition. Nations see it as an imperative to invest heavily in semiconductor ...

Industry-leaders will create hub for R&D with prototype production line for 515 x 510mm panel-level organic interposers Resonac will establish an "Advanced Panel Level Interposer Center (APLIC)" as ...