From AI to high-performance computing -- we take a look at emerging use cases and predictions in the industry AUSTIN, ...

The artificial intelligence (AI) revolution has expanded rapidly since 2023, powering applications from chatbots to ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

Industry-leaders will create hub for R&D with prototype production line for 515 x 510mm panel-level organic interposers Resonac will establish an "Advanced Panel Level Interposer Center (APLIC)" as ...

In today's fast-changing technological landscape, two key theories determine the future of semiconductor design: Moore's Law and the More-than-Moore approach. While Moore's Law focuses on increasing ...

Led by Professor Tony Feng Shien-Ping from the Department of Systems Engineering at CityUHK, the research team developed a novel material to address the complex metallisation challenges in the ...

Needham analyst Charles Shi reiterated Taiwan Semiconductor Manufacturing Co (NYSE:TSM) with a Buy and a $225 price target. Taiwan Semiconductor guided 2025 revenue growth to be in the mid-20s percent ...

TSMC reportedly turned down a request by NVIDIA CEO Jensen Huang for the Taiwanese semiconductor giant to set up a dedicated packaging manufacturing line for NVIDIA's products. In the world of chips, ...

ONYX 3200 metrology equipment enables the complete metal inspection for all processes -- from chip wiring to advanced ...

Purdue University President Mung Chiang made it official Wednesday: South Korea-based semiconductor chipmaker SK Hynix Inc. plans to establish a nearly $4 billion advanced packaging fabrication and ...