A technical paper titled “Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing” was published by researchers at ...
During standardized chip fabrication, integrate circuit (IC) testing is conducted repeatedly to inspect the chips once they are manufactured. IC testing begins with wafer penetration before etched ...
Heterogeneous integration is driving innovation in the semiconductor industry, but it also introduces more complexity in chip design, which translates to more intricate test requirements. The ...
EAST AURORA, N.Y.--(BUSINESS WIRE)--Astronics Corporation (NASDAQ: ATRO), a leading provider of advanced technologies for the global aerospace, defense, and semiconductor industries, announced today ...
East Aurora, NY. Astronics Corp. through its wholly-owned subsidiary Astronics Test Systems has introduced its new system-level test (SLT) platform that is expected to revolutionize the testing of ...
Amkor Technology Inc. in collaboration with the Trump Administration, announced the groundbreaking and expanded planned investment of its new state-of-the-art outsourced semiconductor advanced ...
SAN FRANCISCO — IC packaging test specialists Antares conTech Inc. and UMD Advanced Test Technologies Inc. have agreed to merge. Antares (Gilbert, Ariz.) is a provider of high-end sockets and ...
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