Fujifilm announced its plan to strengthen its business in materials for semiconductor back-end processes at a semiconductor materials business briefing held in Tokyo on July 15, 2025. The company aims ...
TOKYO--(BUSINESS WIRE)--Resonac Corporation (TOKYO:4004) (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a glass ...
TOKYO, Oct. 1, 2025 /PRNewswire/ -- Nikon Corporation is reaffirming the availability of its Digital Lithography System, DSP-100, with orders having commenced in July 2025. This system is specifically ...
Nikon has announced plans to launch exposure equipment for the back-end semiconductor process in fiscal year 2026 (April 2026 to March 2027), utilizing a photomask-free approach, in its first venture ...
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