A new technical paper titled “Mechanically-flexible wafer-scale integrated-photonics fabrication platform” was published by researchers at MIT and New York Center for Research, Economic Advancement, ...

The U.S. Department of Commerce has awarded TI up to $1.6 billion in CHIPS Act funding to support three new 300mm semiconductor wafer fabs under construction in Texas and Utah. TI also expects to ...

LEUVEN, Belgium — IMEC, an independent research organization based here, inaugurated a 300-mm wafer fab Friday (May 7) that is aimed at helping a drive towards nanometer-scale electronics. The opening ...

MEMC Electronic Materials Inc. today said it has moved its pilot line at its center of excellence over to a full-scale 300mm silicon manufacturing site. MEMC, based in St. Peters, Mo., also announced ...