In the past few years, there have been a number of announcements involving advanced packaging architectures for semiconductor devices. These architectures offer product designers tremendous ...

Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.

The era of the voice-only mobile phone is behind us. While voice will always be a key driver for mobile phone use, today's 3G handsets are multimedia systems with color displays, games, audio, video, ...

Despite a year of lackluster growth, wireless communications customers are still in the driver's seat when it comes to pushing for advanced packaging technologies that play into their requirements for ...

FREMONT, Calif.--(BUSINESS WIRE)--OIF, where the optical networking industry’s interoperability work gets done, continues its efforts to reduce cost and speed market adoption of next-generation ...

This paper aims to emphasize on the importance of integrating design for failure analysis in the layout considerations during the IC development process. It will have a brief overview on the ...

The miniaturization trend in electronic devices and the rise in smart and IoT device segments make adopting heterogeneous integration of chip components or 3D-ICs a viable option for miniaturization ...

Altera Corp. and the Taiwan Semiconductor Manufacturing Company (TSMC) have jointly developed the world’s first heterogeneous 3D IC test vehicle using TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) ...

Dublin, May 10, 2021 (GLOBE NEWSWIRE) -- The "Global Touch and Display Driver Integration (TDDI) IC Market: Size, Trends & Forecasts (2021-2025 Edition)" report has been added to ...

Dublin, May 10, 2021 (GLOBE NEWSWIRE) -- The "Global Touch and Display Driver Integration (TDDI) IC Market: Size, Trends & Forecasts (2021-2025 Edition)" report has been added to ...