Playing a crucial interconnect role in integrated circuits and semiconductor testing, test sockets, aka package probes, serve the role of connecting a device and its tester. IC sockets are categorized ...

The high-frequency Center Probe and CSP/MicroBGA test and burn-in sockets are now offered in sizes up to 6.5-mm2 with pitches down to 0.3 mm to enable the testing of smaller components. The sockets ...

Aries Electronics chose Wescon (Santa Clara, CA, April 12-14, www.wescon.com) to highlight a new test and burn-in socket as well as a new RF socket. The company's new test and burn-in socket ...

As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...

Efficient, stable, and high-yield semiconductor production depends on one often-overlooked factor: the health of your test sockets. In many factories, socket maintenance and inspection practices haven ...

For leading-edge devices such as RF ICs, increasing frequency, package density, and thermal issues offer significant challenges to designing effective socket and load-board solutions for test.