Intel Corp. today showcased a new class of Intel Core Ultra X9 and X7 processors, the first new chips built on its most ...

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.

TL;DR: Apple is collaborating with TSMC to adopt advanced WMCM and SoIC packaging technologies for its next-generation A20 and server chips in 2026. These innovations enable ultra-dense chip stacking, ...

The chiplet-based approach allows Intel to mix-and-match these tiles to offer three distinct iterations of Panther Lake: the ...

Average Al chip-package size to triple by 2030 for more memory and computing cores Advanced packaging is becoming a core driver of semiconductor performance and profitability as artificial ...

The advanced packaging architecture designed for AI and high-performance computing (HPC) applications involves positioning memory in close proximity to AI processors, such as GPUs and AI ASICs, on a ...

Intel Corp. is set to revamp its contract chip manufacturing business by pivoting away from its highly publicized 18A process and switching its attention to its next-generation 14A node in an effort ...

Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...

VCG . SK Hynix said on Tuesday that it has decided to invest 19 trillion won ($12.9 billion) to build an advanced chip ...

US export controls keep China behind in the chip war, yet advanced packaging and post–Moore’s Law innovations offer new paths forward. But what does it mean to be ahead or behind in semiconductors? To ...

TSMC is the clear leader in advanced chip manufacturing.