IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

SCHOTT’s new hermetic packages weigh up to two-thirds less than conventional microelectronic packages made of kovar. Made of aluminum, the new packaging is designed to protect against the harsh ...

High-reliability packages, always in demand within the automotive, medical, and RF fields, are now going green. A fully qualified flip-chip small-outline IC (FC-SOIC) narrow body package developed by ...

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...