EDN

Signal integrity modeling tools critical to high speed IC package design

As operating speeds continue to steadily increase, the performance of packaging interconnects can dominate overall device performance, often in a negative way. Therefore, with increased signal speeds, ...
EDN

Signal-integrity suite links ICs, packages, PCBs

SANTA CRUZ, Calif. — Claiming to provide a “unified platform” for signal integrity analysis at the chip, package, module, and PCB levels, Applied Wave Research Inc. this week is rolling out the AWR SI ...
Electronic Design

Signal Integrity Studio Software Package

LeCroy Corporation announced the launch of an extension to their signal integrity product line: Signal Integrity Studio (SI Studio). SI Studio is targeted to signal integrity engineers who want the ...
Electronic Design

Cadence Helps Add Another Dimension to Chip Designs with 3D Tools

Cadence is trying to automate more aspects of the chip design process with Integrity 3D-IC, a suite of software tools it says can help engineers develop faster, less power-hungry chips using 3D ...
MD&M East

Common Mistakes in Validating Package Systems

A medical device's package plays a key role in safely delivering treatment to patients. It must ensure the integrity of the device from the point of manufacture to the point of final use. In addition, ...