Copper interconnects cannot deliver the high-performance requirements of modern systems, especially with the rapid expansion ...

The advent of big data era raising significant challenges in information processing, especially in the aspect of capacity and power consumption. Situations become even worse when we consider the fact ...

TL;DR: TSMC is advancing silicon photonics with co-packaged optics (CPO) samples for NVIDIA and Broadcom by 2025, achieving 1.6 terabits-per-second speeds. The technology integrates microring ...

How a single silicon chip was designed to be microwave and optical signal-processing engine. The various roles for which this engine can be reconfigured. The performance considerations that were ...

Fabrinet’s FN position as a leading optical packaging specialist has become increasingly strategic as the industry transitions to higher bandwidth requirements and advanced data center architectures.

Modern-day communications rely on both fibre-optic cables and wireless radiofrequency (RF) microwave communications. Reaching higher data transmission capabilities is going to require technologies ...

Scientists have developed a compact optical amplifier based on a photonic chip that vastly outperforms traditional optical amplifiers in both bandwidth and efficiency. This breakthrough could reshape ...