Multishot molding techniques enable many components, such as gaskets or handles, to be molded directly into parts. Photo courtesy of MGS MANUFACTURING GROUP (Germantown, WI) As many molders see it, ...

Fan-out wafer-level packaging (FOWLP) is a key enabler in the industry shift from transistor scaling to system scaling and integration. The design fans out the chip interconnects through a ...

Two days before Ken Shaner, VP of manufacturing engineering for Lear Corp. (Southfield, MI), stood before trade press and automotive OEM reps at Husky''s Detroit Technical Center to unveil a ...

System-in-package (SiP) is quickly emerging as the package option of choice for a growing number of applications and markets, setting off a frenzy of activity around new materials, methodologies, and ...

Switching self-adhesive silicones let a molder avoid a costly equipment purchase, cut process steps, and reduce scrap. Multimaterial molding is supposed to take advantage of the efficiencies in ...

Soft lithography is a family of non-photolithographic techniques used for fabricating micro- and nanostructures using elastomeric stamps, molds, and conformable photomasks. Unlike conventional ...