SINGAPORE, Jan. 08, 2025 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s current ...
TL;DR: Micron has begun shipping its industry-leading 11Gbps HBM4 DRAM, delivering over 2.8TB/s bandwidth with superior performance and power efficiency. The company plans to partner with TSMC for ...
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