Intel Corp. will build glass into its most advanced processors to make them faster and more power-efficient. The chipmaker detailed the plan today ahead of its annual Intel Innovation event, which is ...

No matter what, it's clear at this point that the way forward for the semiconductor industry is chiplets, or "tiles" in Intel nomenclature. Piling multiple pieces of a processor onto one package ...

Glass substrates could be the key to linking up massive multi-chiplet processors of the near(ish) future. When you purchase through links on our site, we may earn an affiliate commission. Here’s how ...

Join the event trusted by enterprise leaders for nearly two decades. VB Transform brings together the people building real enterprise AI strategy. Learn more Intel said it has made a significant ...

Intel has provided more details about the glass substrate at its annual event while promising to deliver 1 trillion transistors in a package by 2030. At the “Intel Innovation” event in San Jose, ...

Intel has unveiled a glass core substrate for future semiconductor advanced packaging. Expected to be ready for the end of the decade for both Intel and Intel Foundry customers, the company believes ...

Intel Corporation INTC is set to revolutionize the industry with the ground-breaking launch of glass substrates for advanced packaging of chips. This industry-leading product is likely to be available ...

These days when we talk about what's next for chip design, we focus on things like cramming in more cores, increasing clock speeds, shrinking transistors and 3D stacking. We rarely think about the ...

Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...

Chiplets and advanced packaging have been on the cutting-edge of electronic technology for a while, but Intel is changing where it might be headed. Today’s organic substrates, like Ajinomoto build-up ...

In a significant stride towards the future of computing, Intel has unveiled one of the industry’s pioneering glass substrates for next-generation advanced packaging. This groundbreaking development, ...

The big picture: Most expect that by the end of the decade, the semiconductor industry will hit a wall in terms of being able to scale transistors on silicon using organic materials. Scaling is key to ...