The ASIL-C sensor is claimed to be the smallest in the industry, while the module targets driver-monitoring hardware. Among the primary challenges facing engineers developing imaging sensors for ...

New Monolithic Lens Molding (MLM) capability enables up to eight-megapixel-and-higher-resolution devices. CHIBA, Japan, Dec. 1, 2010 /PRNewswire/ -- SEMICON JAPAN -- EV Group (EVG), a leading supplier ...

By stacking less than 2um thick CMOS device layers into atomically bonded, heterogeneous circuit elements, overall system bandwidth and performance is enhanced for applications including stacked CMOS ...

IBM and one of its partners have figured out how to bond two silicon wafers together without requiring a glass carrier, theoretically simplifying the entire process. Share on Facebook (opens in a new ...

Leveraging years of stacked BSI sensor production, Tower’s wafer-scale 3D-IC technology unlocks integration of SiPho and EIC processes for emerging applications such as Co-Packaged Optics, including ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OVMed® OCHTA camera module with quadruple the ...

LONDON — Silicon-on-insulator (SOI) wafer and substrates supplier Soitec SA (Bernin, France) has said its circuit stacking technology is ready for technology transfer and manufacturing. So-called ...

Stacking chiplets vertically using short and direct wafer-to-wafer bonds can reduce signal delay to negligible levels, enabling smaller, thinner packages with faster memory/processor speeds and lower ...

High-resolution photos of the GEMINI FB XT can be downloaded from EVG's website at http://www.evgroup.com/en/about/news/ Vertical stacking of devices has become an ...

SANTA CLARA, Calif. – Aug. 25, 2020 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OS02G10 security image sensor, which provides the ...