LG Innotek has developed a next-generation smart IC (integrated circuit) substrate, a core component in smart cards, that requires no metal plating. The breakthrough ...
IC substrate and PCB maker AT&S (Advanced Technologies & Solutions) has been expanding its IC substrate manufacturing footprint in Asia before COVID-19 outbreak. It has moved equipment into the latest ...
The "Advanced IC Substrates Market Size, Share & Industry Analysis Report By Type, By Technology, By Application, By Regional Outlook and Forecast, 2025-2032" report has been added to ...
Malaysia Semiconductor IC Design Park 2 represents a strategic shift towards higher-value activities such as IC design, advanced testing, validation, and research.
Cuts carbon dioxide emissions from its production by 50%—equivalent to planting 1.3 million trees annually. Boosts durability by up to three times for secure information recognition even with ...
SANTA CLARA, Calif.--(BUSINESS WIRE)--TSMC (TSE: 2330, NYSE: TSM) today announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform ® (OIP) 3DFabric Alliance at ...
New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...
Big Fund Phase III has not made direct investments in semiconductor companies, deploying capital through affiliated ...
SEOUL, South Korea, Dec. 22, 2025 /PRNewswire/ -- LG Innotek (CEO Moon Hyuksoo) announced on December 22 that the company has successfully developed a 'Next-Generation Smart IC (integrated circuit) ...
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