The Simcenter Micred Quality Tester from Siemens enables the assessment of a semiconductor package's thermal structure to identify manufacturing defects, including die-attach issues. With the ...
Guadalajara plan expands ASE’s global footprint, increases presence in North America The future establishment of a semiconductor packaging and test facility in Jalisco paves the way for the ...
A technical paper titled “Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing” was published by researchers at ...
Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces the groundbreaking and expanded ...
Amkor Technology Inc., a leading provider of semiconductor packaging and testing services, said it plans to build an advanced facility in Peoria that could cost $2 billion, bring roughly 2,000 jobs ...
Copper interconnects cannot deliver the high-performance requirements of modern systems, especially with the rapid expansion ...
During standardized chip fabrication, integrate circuit (IC) testing is conducted repeatedly to inspect the chips once they are manufactured. IC testing begins with wafer penetration before etched ...
Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...
The Taiwanese government decided to raise electricity prices by an average of about 10% starting in April, with industrial electricity prices up by nearly 14%, the third consecutive year Taiwan raised ...
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