In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of ...

LAS VEGAS, NV, UNITED STATES, January 20, 2026 / EINPresswire.com / — CIT (CEO Seung Jeong) announced its participation in ...

TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...

Image transfer, also known as photolithography (or simply, lithography), plays a crucial role in defining the circuit patterns on a panel. With photolithography, IC substrate manufacturers can ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

The Global Electronics Association has published a new international standard, IPC‑6921, for organic IC substrates.

Suppliers of IC packaging materials including leadframes and substrates are poised to raise their prices in the second quarter to reflect rising raw materials costs, despite a slight slip in capacity ...

Combined, laminate substrates and leadframes will represent an estimated US$ 13.3 billion market in 2011 and is forecasted to reach $14 billion in 2012. This is larger than the revenues for silicon ...

The semiconductor is a highly integrated device that cannot be connected directly to the main board in the way that condensers or resistors can. Therefore, a packaging substrate (or intermediary layer ...

[Asia Economy Reporter Suyeon Woo] As the semiconductor industry experiences a boom, supply shortages have extended to the raw material package substrates, rapidly improving the profitability of ...

DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/6thwv5/global_and_china) has announced the addition of the "Global and China ...

KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging platform to support mainstream and advanced IC substrate lithography ...