Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some ...
CHANDLER, Ariz. — Amkor Technology Inc. today outlined a new backend manufacturing strategy to integrate final chip assembly and testing steps by performing parallel tests on multiple ICs while they ...
Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...
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