LG Innotek has entered the glass substrate business, which is regarded as a "game changer" in next-generation semiconductor ...

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Korean electronic components manufacturer LG Innotek said Thursday that it has partnered with glass processing specialist UTI ...

Together with partners, the SCHMID Advanced Integrated Circuit (IC) Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass ...

Samsung and Intel are known for having a troublesome journey in the semiconductor field. Both companies are often overshadowed by NVIDIA, AMD, and TSMC. However, things might change soon as Samsung is ...

Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of ...

It's not just AMD, but Intel, Samsung, LG Innotek, and SK Group's US subsidiary Absolics are all systems pushing into glass substrate technology for advanced packaging. Intel announced in September ...

The glass substrates segment is projected to grow at the highest CAGR in the forecast period. Glass substrates are projected to experience rapid growth within the MEMS packaging substrates market due ...

South Korean giants Samsung Electronics and SK Group are "speeding up efforts" to secure future dominance in glass substrates, which would be a "game-changer" for the semiconductor and AI industries.

China's glass substrate through glass via (TGV) industry has made significant progress, with companies pushing innovations from materials to mass production. Despite challenges in yield and process ...