No matter what, it's clear at this point that the way forward for the semiconductor industry is chiplets, or "tiles" in Intel nomenclature. Piling multiple pieces of a processor onto one package ...
Join the event trusted by enterprise leaders for nearly two decades. VB Transform brings together the people building real enterprise AI strategy. Learn more Intel said it has made a significant ...
Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...
Subsidiaries of the Samsung Group will collaborate to invest in the research and development of Glass Core Substrates (GCS) to expedite their commercialization — and which Apple is eyeing, according ...
Intel has provided more details about the glass substrate at its annual event while promising to deliver 1 trillion transistors in a package by 2030. At the “Intel Innovation” event in San Jose, ...
Intel has unveiled a glass core substrate for future semiconductor advanced packaging. Expected to be ready for the end of the decade for both Intel and Intel Foundry customers, the company believes ...
AMD has been granted a patent (12080632) that covers glass core substrate tech. Glass substrates will replace traditional organic substrates for multi-chiplet processors in the coming years. The ...
Chiplets and advanced packaging have been on the cutting-edge of electronic technology for a while, but Intel is changing where it might be headed. Today’s organic substrates, like Ajinomoto build-up ...
Intel Corp. will build glass into its most advanced processors to make them faster and more power-efficient. The chipmaker detailed the plan today ahead of its annual Intel Innovation event, which is ...
AMD has been granted a patent (12080632) that covers glass core substrate technology. For those who came in late, glass substrates, made from materials like borosilicate, quartz, and fused silica, ...
SHENZHEN, China, Dec. 8, 2025 /PRNewswire/ -- PCBAIR announced the launch of its advanced 8-layer Glass Core PCB manufacturing capabilities, combining proprietary Through Glass Via (TGV) technology ...
The drive for increased performance is enticing some advanced packaging manufacturers to transition from traditional organic substrates to glass core substrates, a switch that comes with numerous ...
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