In 2001, IBM patented a method of using a double bump material structure to make a reliable joint between a chip and its package for bump pitch below 150 µm. 1 This invention improved the existing ...
Professor of Mechanics, Washington University, St. Louis, Mo. It's easy to construct finite-element models with errors. And it's just as easy to correct them, when you know how. The first step in a ...
Development of Deformity Specific Finite Element Models for Surgical Simulation of Anterior Vertebral Body Tether for Treating Scoliosis in Pediatric Subjects Adolescent Idiopathic Scoliosis (AIS) is ...
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