To achieve gains in power, performance, area, and cost, 3D-IC architectures are pushing electronics design to new limits. Silicon integration technology and associated devices have undergone an ...
Maintaining the quality and reliability of electrical signals as they travel through interconnects is proving to be much more challenging with chiplets and advanced packaging than in monolithic SoCs ...
As every engineer learns at an early stage, clock edges must be obeyed. In the digital domain, synchronization through global and local clock trees, slew rate and rising/falling times all combine to ...
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