Samsung Electro-Mechanics (Semco) has announced plans to spend more on its FCBGA packaging substrate production in South Korea and Vietnam. Save my User ID and Password Some subscribers prefer to save ...
An update on flip chip ball grid array (FCBGA) package development as quality and reliability requirements increase for larger and larger package form factors and approaches that should be taken to ...
SoC designs require the integration of digital signal processor cores, custom logic, memory and analog on a single chip. Consequently, these designs require signal integrity of critical nets, and ...
Samsung has just announced a new partnership with AMD, with the South Korean giant to provide high-performance substrates for AMD's next-gen CPUs and GPUs for data centers. Samsung Electro-Mechanics ...
Korea's top three PCB suppliers SEMCO, LG Innotek and Daeduck, after discontinuing their unprofitable PCB products and moving toward high-end IC substrates, have stabilized their PCB revenue and ...
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