Part I of this article discusses the design-for-test (DFT) challenges of AI designs and strategies to address them at the die level. This part focuses on the test requirements of AI chips that ...
Understanding connectivity issues and interactions are only part of the problem; ECOs can cause unexpected problems in other ...
TOKYO, Dec. 09, 2024 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced an integrated test cell designed to maximize die-level test ...
TOKYO, Dec. 16, 2025 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) ("Advantest") and Tokyo Seimitsu Co., Ltd. (TSE: 7729) ("Tokyo Seimitsu") ...
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