A new technical paper titled “DECOR: Deep Embedding Clustering with Orientation Robustness” was published by researchers at Oregon State University and Micron Technology. “In semiconductor ...
Defect inspection scientists from Huazhong University of Science and Technology, Harbin Institute of Technology and The Chinese University of Hong Kong make a thorough review of new perspectives and ...
A new technical paper titled “Semi-Supervised Learning with Wafer-Specific Augmentations for Wafer Defect Classification” was published by researchers at Korea University. “Semi-supervised learning ...
Each of the inspection systems in the new portfolio features seamless connectivity to the recently introduced eDR-7000 e-beam wafer defect review system. With outstanding sensitivity and review speed, ...
As the automotive electronics market continues to grow, spurred by developments such as semi-autonomous and fully autonomous vehicles, the demand is increasing for power semiconductor components with ...
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