Applied Materials has revealed chip wiring innovations that will help address challenges in the way of energy-efficient computing. The use of new materials in chip wiring will enable two-nanometer ...

In context: As we approach the 2nm process node, some roadblocks are emerging that could further stagnate the already slow Moore's Law progress. One challenge is how to efficiently distribute power to ...

Collaborative R&D at Applied’s EPIC Center in Silicon Valley will enable higher yields and faster commercialization of next-generation ...

Kinex™ is the industry’s first integrated die-to-wafer hybrid bonding system; enables production of higher performance, lower power advanced logic and memory chips Xtera™ system enables higher ...

Industry’s first use of ruthenium in high-volume production enables copper chip wiring to be scaled to the 2nm node and beyond and reduces resistance by as much as 25% New enhanced low-k dielectric ...