In the run-up to pv magazine’s quality roundtable at Intersolar Europe, we look at a case where a production error resulted in cold solder joints in 5% of the solar ...

Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...

Board manufacturers are boosting their investment in inspection, test and analytics to meet the increasingly stringent demands for reliability in safety-critical sectors like automotive. This ...

Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...

X-ray and advanced automated techniques combine to create a capable tool for lead-free solder inspection needs. Within two years, solder used in electronics manufactured or sold in Europe must meet ...

OAKLAND, Calif.--(BUSINESS WIRE)--Digicom Electronics, Inc., a technology and quality driven electronics manufacturing services company, presents its new Diamond Track Defect Mitigation Services at ...