SEOUL, Jan 13 (Reuters) - South Korea's SK Hynix said on Tuesday it has decided to invest 19 trillion won ($12.90 billion) to ...
Taiwan has launched CoCoB, a substrate-less chip packaging platform targeting academic institutions and startups locked out ...
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Why chip packaging is the next big thing
As demand for faster, smaller, and more energy-efficient electronics intensifies, advanced packaging has emerged as a critical enabler of progress in the semiconductor industry. By integrating ...
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Intel details new advanced packaging breakthroughs — EMIB-T paves the way for HBM4 and increased UCIe bandwidth
Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...
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