AMD has been granted a patent (12080632) that covers glass core substrate tech. Glass substrates will replace traditional organic substrates for multi-chiplet processors in the coming years. The ...

A new supply-chain report suggests that Apple is seeking to be an early player in what some believe will be the next big thing in chip development: printed circuit boards (PCBs) made from glass ...

Intel has provided more details about the glass substrate at its annual event while promising to deliver 1 trillion transistors in a package by 2030. At the “Intel Innovation” event in San Jose, ...

Why it matters: AMD may not manufacture its own chips anymore, but that hasn't stopped it from investing in research and custom process technologies for its chips. Now, the company has its sights on ...

The big picture: Most expect that by the end of the decade, the semiconductor industry will hit a wall in terms of being able to scale transistors on silicon using organic materials. Scaling is key to ...

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of ...

Intel Corporation INTC is set to revolutionize the industry with the ground-breaking launch of glass substrates for advanced packaging of chips. This industry-leading product is likely to be available ...

Intel's Innovation event starts tomorrow, and to kick things off, Chipzilla is revealing more information about its work with glass substrates. It sees this technology as the best future alternative ...

As a package substrate, the benefits of glass are substantial. It’s extremely flat with lower thermal expansion than organic substrates, which simplifies lithography. And that’s just for starters.

Since the end of 2024, a critical shortage of T-Glass has been disrupting the global supply chain for advanced chip packaging. This specialized glass fabric, prized for its low thermal expansion ...