SAN FRANCISCO, June 27, 2024 /PRNewswire/ -- Dr. Larry Zu, Founder and CEO of Sarcina Technology, the Application Specific Advanced Packaging (ASAP) Design Service and Production leader, predicted ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

Irvine, CA – Henkel recently announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market's most demanding advanced packages, ...

The chip industry is ratcheting up investments in advanced packaging as it strives to keep pace with demands for increased functionality and higher performance, including novel patterning technologies ...

There's better, cost-effective path to 2.5D packaging landscape SAN FRANCISCO, June 27, 2024 /PRNewswire/ -- Dr. Larry Zu, Founder and CEO of Sarcina Technology, the Application Specific Advanced ...