Forbes contributors publish independent expert analyses and insights. Samsung had an industry Foundry event focused on solutions for “Empowering the AI Revolution,” where they announced new process ...
The fourth annual Chiplet Summit, the largest conference dedicated to chiplets, today reported on its 2026 Best of Show Awards at the Santa Clara Convention Center. The winners are: ...
The move to multi-die integration brings both promise and complexity. Scalable interconnects and automation are emerging as ...
Heterogeneous integration and system-level integration seen as 'next step' in advanced packaging era
With TSMC's CoWoS and the 2.5D advanced packaging from OSAT companies becoming a hot topic due to capacity shortages, advanced packaging solutions are seen as the next big thing. Save my User ID and ...
The move away from monolithic SoCs to heterogeneous chips and chiplets in a package is accelerating, setting in motion a broad shift in methodologies, collaborations, and design goals that are felt by ...
The heterogeneous integration of multiple chiplets in a single packaging platform is critical for many high performance compute segemnts such as AI, Hyperscalers, Cloud datacenters, Neural processors ...
InPsytech, a leading company under the Egis Technology Group specializing in high-speed semiconductor IP solutions, has completed its advanced design for TSMC's Face-to-Face (F2F) SoIC technology, ...
The rapid evolution of heterogeneous integration and packaging technologies is reshaping the landscape of electronic design by enabling the assembly of diverse, specialised chip components into ...
Researchers at Shanghai University have developed a physics-constrained, data-efficient artificial intelligence framework that enables accurate thermal field inversion in chiplet-based packaging ...
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